Blitz Bureau
NEW DELHI: India expects four semiconductor plants to be ready this year, with two more in 2027, on a roadmap that Electronics and IT Minister Ashwini Vaishnaw has laid out from packaging and testing today to full fabrication by the end of the decade — a step-by-step climb up one of the world’s most demanding value chains.
The near-term plants are assembly-and-test facilities: Micron and Kaynes Semicon are already up at Sanand in Gujarat, with more units following. The country’s first commercial fabrication unit, the Tata Electronics–PSMC project at Dholera, is the larger prize further out. Backing the effort is government support exceeding $10 billion across India’s AI, quantum and semiconductor missions.
Packaging first, fabrication next — India is climbing the chip value chain one plant at a time, and the next rungs are now in sight.
At a Glance
- Plants: Four ready in 2026; two more in 2027
- Live now: Micron and Kaynes Semicon at Sanand, Gujarat
- Fab: Tata–PSMC at Dholera — India’s first, later this decade
- Support: Over $10bn across AI, quantum and chip missions
Talent is filling in behind the concrete. Tens of thousands of engineers have been trained on industry-standard design tools, and global firms including Nvidia, AMD and Intel are running advanced chip-design work in India — including on the most cutting-edge nodes. The honest challenge is depth: India still imports most of its chipmaking equipment and materials, and a full front-end capability is a patient, multi-year build.
The constructive read is that the base of the value chain is now being laid in India, plant by plant. Assembly at scale today, fabrication tomorrow — the sequence on which a durable domestic chip industry is built.
