Blitz Bureau
NEW DELHI: India expects four semiconductor plants to be ready this year, with two more in 2027, on a roadmap that Electronics and IT Minister Ashwini Vaishnaw has laid out from packaging and testing today to full fabrication by the end of the decade — a step-by-step climb up one of the world’s most demanding value chains.
The near-term plants are assembly-and-test facilities: Micron and Kaynes Semicon are already up at Sanand in Gujarat, with a third unit due to be inaugurated this month. The country’s first commercial fabrication unit, the Tata Electronics–PSMC project at Dholera, is the larger prize — a 300mm fab targeting first silicon by December 2026 and full readiness by 2028.
Blueprint to buildings: Assembly and test plants come online this year; fabrication is the longer climb ahead.
Packaging first, fabrication next — India is climbing the chip value chain one plant at a time, and the next rungs are now in sight.
At a Glance
- Plants: Four ready in 2026; two more in 2027
- Live now: Micron and Kaynes Semicon at Sanand, Gujarat
- Fab: Tata–PSMC at Dholera — first silicon targeted December 2026
- Ambition: Among the world’s top six chip nations by 2032
Talent is filling in behind the concrete. Tens of thousands of engineers have been trained on industry-standard design tools, and global firms including Nvidia, AMD and Intel are running advanced chip-design work in India, including on the most cutting-edge nodes. The honest challenge is depth: India still imports most of its chipmaking equipment and materials, and a full front-end capability is a patient, multi-year build.
The constructive read is that the base of the value chain is now being laid in India, plant by plant. Assembly at scale today, fabrication tomorrow — the sequence on which a durable domestic chip industry is built.
