Blitz Bureau
NEW DELHI: The Cabinet, chaired by Prime Minister Narendra Modi, on August 12 approved four more semiconductor projects under the India Semiconductor Mission (ISM) with an outlay of Rs 4,600 crore. The four proposals approved are from SiCSem, Continental Device India Private Limited (CDIL), 3D Glass Solutions Inc., and Advanced System in Package (ASIP) Technologies.
With these, the total approved projects under the ISM have reached 10, with cumulative investments of around Rs 1.60 lakh crore in six states.
“These four approved proposals will set up semiconductor manufacturing facilities with a cumulative investment of around Rs 4,600 crore and are expected to generate a cumulative employment for 2,034 skilled professionals, which would catalyse the electronic manufacturing ecosystem, resulting in the creation of many indirect jobs,” a Cabinet communique said. SiCSem and 3D Glass will be set up in Odisha. CDIL is located in Punjab, and ASIP will be set up in Andhra Pradesh.
SicSem Private Limited is collaborating with Clas-SiC Wafer Fab Ltd., UK, to establish an integrated facility of silicon carbide-based Compound Semiconductors in Info Valley, Bhubaneshwar. This will be the first commercial compound fab in the country. The project proposes to manufacture silicon carbide devices. This compound semiconductor fab will have an annual capacity of 60,000 wafers and a packaging capacity of 96 million units.
The proposed products will have applications in missiles, defence equipment, electric vehicles (EVs), railways, fast chargers, data centre racks, consumer appliances, and solar power inverters, the Cabinet note said.
